Argenta Elektronik

IDI Spring Probes Smiths Interconnect

IDI has optimized the design to achieve a low contact resistance and ensure a reliable contact between the spring pin and the outer body.
This technology is also referred to as baising.
A bias ball is located between the spring and the tip whereby the tip tilts inside the outer body and is pressed against the inner wall. The result is a very low and controlled internal resistance.

The IDI spring probe technology is characterized by:


High Insertion Life
Spring contact probes are capable of remarkable longevity up to 50K cycles based on design (Mating cycles are dependent on the used materials and could be higher). The IDI spring probes are driven by helical coil springs, which maintain a constant force of contact over millions of cycles.

Constant contact resistance
Both the Baising technology, as well as the special design of the contacts with round tip allow a low and constant contact resistance (<10mOhm) over the entire lifetime and show extremely low fluctuations.

Low Profile, High Compliance Ratio
Spring probe technology permits a very high compliance-to-length ratio. This allows Smiths Connectors to design connectors as dense as 2mm, while maintaining 0.5mm of compliance. Spring probe connectors are low profile designs which are forgiving of challenging mating conditions and vibration environments.

High Frequency
A short signal path, combined with design and signal integrity expertise, ensures remarkable connector solutions for both analog and digital applications. Speeds of 12 Gb/S and bandwidths of 20 GHz can be achieved with spring probe interposers. Spring probe connectors can also be made coaxial through the use of insulators and metal interposer bodies.

Low Stable Resistance
Smiths Connectors’ spring probes feature several innovations for control of DC performance. Advanced biasing techniques provide excellent stability of contact resistance, even under conditions of heavy shock and vibration. Our connectors can be designed to withstand up to 42 Amps of current.

Solid contact
There is only one point of contact, which touches the target contact, so a misalignment between spring pin and target contact can be easily compensated.
Typical applications for the IDI spring probe technology are:

  • Needles for board test applications
  • Test sockets
  • Battery chargers
  • Military radios
  • Portable devices
  • PCB Interposer
  • Interface probes
  • SMT probes
  • TH probes
  • Connector probes
  • Spring Probe Connectors

Partnumbers (extract)

CG-2.5-4-TH CP-2.5-4-TH CG-2.5-4-SM CP-2.5-4-SM CG-2.5-4-SC CP-2.5-4-SC CG-2.5-6-TH CP-2.5-6-TH CG-2.5-6-SM CP-2.5-6-SM CG-2.5-6-SC CP-2.5-6-SC 101620-000 101620-001 101621-000 101621-001 101622-000 101622-001 101623-000 101623-001 101624-000 101624-001 101625-000 101625-001 CG-2.5-6-TH-BB CP-2.5-6-TH-BB CG-2.5-6-SC-BB CP-2.5-6-SC-BB CG-2.5-6-SM-BB CP-2.5-6-SM-BB 101880-000 101880-001 101881-000 101881-001 101883-000 101883-001

Battery Probes
100410-005 100606-000 100671-000 100803-011 100804-002 100891-002-922 101050-003 101050-005 101111-008 101119-001 101190-002 101247-001 101294-000 101402-000 101438-000 101506-000 101549-000 101582-000 101602-000 101628-000 101679-000

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